Session Details

Session 7: Decorative Automotive Considerations

Abstract Number:

63

This presentation will describe the development and optimization of the Teleposit™ 8000 ‎LCP ‎Metallization Process; an all chemical process which delivers a highly reliable metal ‎finish for ‎electronic applications and complex geometries.‎

Topics:

Plating on Plastics/Decorative Technology
Technologies for ‎Improved Performance or Increased Efficiency

Liquid Crystal Polymer (LCP) has long been used as a high-performance thermoplastic due to ‎its ‎mechanical strength at high temperature and its chemical inertness. More recently, ‎however, its ‎electrical properties at mmWave frequencies are driving demand in cutting ‎edge electronics, where ‎the relatively low dielectric constant and low and stable dissipation ‎factor are key characteristics. ‎Molded LCP parts are used in a growing number of electronics ‎applications including antennae and ‎high frequency printed circuit board substrates, where ‎a robust and reliable surface metallization is ‎required.‎

Many existing processes for metallizing LCP with high glass and/or mineral filler contents ‎utilize ‎sandblasting to roughen the surface to achieve adequate metal adhesion. Although ‎this can produce ‎adherent metal, it is neither consistent nor uniform, does not work for ‎complex geometries, and for ‎many electronic applications it is unsuitable. This presentation ‎will describe the development and ‎optimization of the Teleposit™ 8000 LCP Metallization ‎Process; an all chemical process which ‎delivers a highly reliable metal finish while ‎eliminating the need for sandblasting. Following the ‎activation and metallization, the ‎substrates may then be finished according to specification with a ‎variety of electroplated ‎solderable or corrosion resistant finishes.‎

LIQUID CRYSTAL POLYMER (LCP) METALLIZATION

Michael Lipschutz

Electronic and Industrial Finishing Applications Technology Group Leader - West

DuPont Electronics & Industrial